Call for Patrons

How to be a Patron

Four levels of patronage with benefits are provided to promote your company among international experts and conference attendees. The brochure and table below highlight the Patronage benefits and pac. The IEEE/IFIP NOMS 2023 Patronage Chairs will work with your company towards maximizing the value of these packages; we will be happy to work with you to customize a package to best fit your needs. As a Patron, your company also becomes eligible to complimentary registrations to the conference.  Please contact the IEEE/IFIP NOMS 2023 Patron Co-Chairs, Filip De Turck (filip.deturck@ugent.be) and Alexander Perez-Pons (aperezpo@fiu.edu).

We look forward to collaborating with you!

 

Level	Fee	Benefits
Platinum	$7,500	Three complimentary Full registrations for conference; 20% discount on up to 2 registrations for additional company participants; Logo on all conference programs; Logo on conference website, with link to company’s website; Company-supplied banner prominently displayed during the Conference; Naming of your company at the opening and closing to highlight the patronage.
Gold	$5,000	Two complimentary Full registrations for conference; Logo on all conference programs; Logo on conference website, with link to company’s website; Company-supplied banner prominently displayed during the Conference; Naming of your company at the opening and closing to highlight the patronage.
Silver	$3,000	One complimentary Full registrations for conference; Logo on all conference programs; Logo on conference website, with link to company’s website;
Bronze	$2000	Logo on all conference programs; Logo on conference website, with link to company’s website;

Patron Brochure

The brochure highlighting the Patronage benefits is available here: https://noms2023.ieee-noms.org/sites/noms2023.ieee-noms.org/files/Patron_Brochure_IEEE_IFIP_NOMS_2023.pdf. Thank you for your consideration.

Patron Co-Chairs

• Filip De Turck, Ghent University – imec, Belgium (filip.deturck@ugent.be)
• Alexander Perez-Pons, Florida International University, USA (aperezpo@fiu.edu)